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| Epi-Cure W |
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| Aromatic amine |
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EPI-CURE Curing Agent W system consists of a bisphenol-F epoxy resin and an aromatic amine for fabricating composite parts using resin transfer molding (RTM) or filament winding.
EPI-CURE Curing Agent W does not contain methylene dianiline (MDA).
Low viscosity and very long working life at room temperature make this system versatile and easy to process.
EPI-CURE Curing Agent Accelerator 537 may be utilized to decrease the gel time of the system with little or no effect on mechanical properties. |
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Nitrogen Content, wt%: 15.7-15.9
Viscosity @ 25'C, (cP): 100-300
Color, Gardner: 7 max.
Amine hydrogen equivalent wt (AHEW): 43-46
Weight per gallon, lb. at 20'C (68'F): 8.4-8.6
Flash point, TCC 135'C (275'F) |
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