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| EPON Resin 1213-B-80 |
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| Epoxy resin |
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| epoxy resin |
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EPON Resin 1213-B-80 is a one pack, dicy-free brominated epoxy resin and curing agent solution supplied as 80% by weight solids in methyl ethyl ketone (MEK).
This resin system was developed to help meet the increasing demands of FR-4 printed circuit board applica-tions and to help provide laminates with a nominal glass transition temperature (Tg) of 145 °C. |
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Weight per epoxide (WPE),g/eq: 375
Resin solids, weight %: 80
Color, Gardner Scale: 11
Bromine content, weight %: 18
Solution viscosity @ 25'C, Poise: 4
Density at 25'C, lb/gal: 10.1
Appearance: Dark Yellow Viscous Liquid |
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