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| Dispersion DPW-6520 |
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| epoxy |
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Developmental Epoxy Resin Dispersion DPW-6520 is a 53% solids, non-ionic aqueous dispersion of a modified EPON Resin 1001 type solid Bis A epoxy.
This resin contains a low level of solvent (acetone and propylene glycol monomethyl ether) and is designed to provide the high performance of traditional epoxy coatings in low VOC, non-HAP water-borne coatings.
Although Developmental Epoxy Resin Dispersion DPW-6520 exhibits good compatibility with many water-reducible amine curing agents, it is designed for use with Developmental Curing Agent Dispersion DPC-6870. |
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Epoxide equivalent weight, g/eq, solids basis: 550
Viscosity at 25'C, cP, Brookfield spindle #5 at 20 rpm: ≤3000
Nonvolatile materials, % weight: 53.0
Density solution basis, lbs/gal (solids basis, theoretical): 9.0 (9.7)
Appearance: Opaque white liquid |
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