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| BYK W 903 |
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| Solution of a copolymer with filler affinic groups |
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BYK W 903 is especially developed for Printed Circuit Board base materials.
It facilitates the incorporation of filler in the resin mix and stabilizes the filler(s) dispersion after the mixing procedure. |
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Density at 20'C: 1.6 g/ml
Flash point: 47 °C
Non-volatile matter 10 minutes 150'C: 40 %
Appearance: clear to light yellow
Solvent: Methoxypropylacetate |
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