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Hipec Q1-4939
2-part clear heat cure, cures to elastomer or gel depending on mix ratio, good flowability.
HIPEC Q1- 4939 Semiconductor Protective Coating is a high purity, two-part, solventless silicone designed for the protection of semiconductor junction surfaces that have higher levels of integration.
It is chemically compatible with most device surfaces, provides physical protection of the chip and inter-connecting wires, and provides stress relief for delicate device leads and the die.
Other secondary features include protection against contamination of the junction surface, shielding against alpha particle penetration and stabilization of device characteristics.
The product can be cured to a soft gel or a compliant elastomer by varying the mix ratio used ?see "Mixing" in "How to Use" section.
One or two part: 2
Color: Clear
Viscosity/Flowability (poise): 50
Specific Gravity: 1.03
Working Time RT: >168 hrs
Heat Cure Time: 2 hrs/150'C
제품관련분야 기타
Dow Corning Corp/Corporate Headquarters
전화번호 517-496-5369; 800-248-2481
팩스번호 517-496-4688
홈페이지 -
이메일
주소 3100 James Savage Rd., PO.Box 994, Midland, MI 48686-0994
이제품에 대해 등록된 판매업체가 없습니다.