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| Dynasolve FS8110 |
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Dynasolve FS8110 is a unique semi-aqueous solvent blend formulated to remove flux residues from wafer bumps found in microelectronic packaging.
It works quickly at relatively low temperatures removing all flux and solder sputter residues without etching the solder bumps.
It does not contain any caustic materials that can be damaging to sensitive electronic metals.
Dynasolve FS8110 can be used in most in-line and batch semi-aqueous equipment including ultrasonics.
*Application: through-hole, surface mount, post-reflow or wave-solder, flip chip/BGA packaging |
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Appearance: amber liquid
Flash point: >175F/ 80C
Specific gravity: 0.912
Surface tension: 21.90 dynes/cm
Viscosity: 20 cp |
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