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| Dynasolve FS8205 |
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Dynasolve FS8205 is a high-strength aqueous formula designed to remove flux residues from wafer bumps found in microelectronic packaging.
It is effective at removing flux and solder sputter while simultaneously leaving the solder bumps a bright finish with no etching.
It is also effective in the removal of a variety of baked-on flux residues.
Dynasolve FS8205 is a low-foam version of Dynasolve FS8200 and can be used in most in-line and batch aqueous and semi-aqueous equipment including high pressure spray-in-air.
*Application: through-hole, surface mount, post-reflow or wave-solder, flip chip/BGA packaging |
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Appearance: clear, colorless liquid
pH, 1% in DI water: 6-7
Specific gravity: 1.049
Viscosity: water thin |
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