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| Dynasolve 2000 Plus |
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Dynasolve 2000 Plus is a reactive solvent formulated specifically for dissolving photo resist films.
It will not attack metals, including vacuum deposited aluminum.
This is an excellent product for use in photolithography processes.
In addition, Dynasolve 2000 Plus also dissolves cured silicone compounds and anhydride cured epoxy compounds from integrated circuits, power transistors, diodes, and hybrid circuits.
Dissolving action is gentle and will not break fragile interconnections, nor swell encapsulants prior to dissolving them.
Dynasolve 2000 Plus will discourage the redeposition of dissolved materials, especially photo resist films.
It is formulated without chemicals on the Hazardous Air Pollutants list as given by the Clean Air Act.
This is especially important for companies working to limit the amount of HAPs they discharge annually. |
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Color: straw
Specific Gravity: 1.07
Flash Point: 97'F (lowest flashing component) |
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