|
|
|
|
|
¿¡À̽ºÀδõ½ºÆ®¸®(ÁÖ) |
ACE INDUSTRIES CO. ,LTD. |
|
|
Á¦Á¶+ÆǸŠ|
|
|
|
#464-861, Neukhyun-Ri, Chowol-Myeon, Gwangju-Si, Gyeonggi-Do, Korea |
|
+82-31-761-8415 |
|
+82-31-761-8416 |
|
KOREA |
|
Kim, Oh-jin |
|
acernd@aceindco.com |
|
www.aceindco.com
|
¾÷ü°ü·ÃºÐ¾ß |
Á¢ÂøÁ¦,½Ç¶õÆ® |
|
|
|
ȸ»ç¼Ò°³
Çʸ§ °¡°ø°ú ÄÚÆÃÀ¸·Î ÀÎÇÏ¿© Á¡ÂøÅ×ÀÌÇÁ Á¦Á¶ ´ç»ç´Â ¹ÝµµÃ¼ Àç·áÀÇ ±¹»êȸ¦ ¸ñÇ¥·Î ¼³¸³µÈ ±â¾÷À¸·Î¼ Çѱ¹ ¹ÝµµÃ¼ »ê¾÷ ¹ßÀüÀÇ ÀÏÀÍÀ» ´ã´çÇÏ°í ÀÖ´Ù´Â Àںνɰú ¼¼°è À¯¼öÀÇ ¹ÝµµÃ¼ ¸ÞÀÌÄ¿¿¡ ¿ì¸®µéÀÇ Á¦Ç°À» ´ç´çÈ÷ °æÀï½ÃÄÑ¾ß ÇÑ´Ù´Â »ç¸í°¨À¸·Î ¿À´Ãµµ ±â¼ú °³¹ß¿¡ ¿ÁßÇÏ°í ÀÖ½À´Ï´Ù. ±× °á°ú °¨¾ÐÇü Back Grinding Tape¸¦ °³¹ßÇѵ¥ À̾î Àڿܼ± °æÈÇü Back Grinding Tape¸¦ ±¹³» ÃÖÃÊ·Î °³¹ßÇÏ¿´½À´Ï´Ù. ±×¸®°í °¨¾ÐÇü Wafer Dicing Tape¿Í Àڿܼ± °æÈÇü Wafer Dicing Tape¸¦ °³¹ß ¿Ï·áÇÏ¿© ±â¼ú·ÂÀ» ÀÎÁ¤¹Þ°í ÀÖÀ¸¸ç ÇöÀç ¼¼°è¼ÓÀÇ ¹ÝµµÃ¼ Tape »ý»ê ¸ÞÀÌÄ¿·Î ¼ºÀåÇÏ¿© Hynix, Fairchild, Chippac µîÀÇ ¼¼°è À¯¼ö ¹ÝµµÃ¼ ¸ÞÀÌÄ¿¿¡ ¿ì¼öÇÑ ³³ÀÔ ½ÇÀûÀ¸·Î ³³Ç°À» ÇÏ°í ÀÖÀ¸¸ç ¹Ì±¹, ´ë¸¸, Áß±¹ µî¿¡µµ ¼öÃâÀ» ÇÏ°í ÀÖ½À´Ï´Ù.
ACE Industries Co., Ltd., has been developing, manufacturing and supplying tape for semiconductor. ACE has been stretching himself as a worldwide semiconductor tape maker by developing and manufacturing the excellent base film, and adhesive both nominally and virtually.
|
|
|
|
|
ÇöÈÇо÷ü°¡ Á¦Á¶ÇÏ´Â ÈÇÐÁ¦Ç° ¸ñ·Ï |
|
ÇöÈÇо÷ü·Î µî·ÏµÈ ÈÇÐÁ¦Ç°ÀÌ ¾ø½À´Ï´Ù! |
|
|
|
ÇöÈÇо÷ü°¡ ÆǸÅÇÏ´Â ÈÇÐÁ¦Ç° ¸ñ·Ï |
|
ÇöÈÇо÷ü·Î µî·ÏµÈ ÈÇÐÁ¦Ç°ÀÌ ¾ø½À´Ï´Ù! |
|
|
ÇöÈÇо÷ü°¡ Á¦Á¶ ¶Ç´Â ÆǸÅÇÏ´Â ÈÇй°Áú ¸ñ·Ï |
|
ÇöÈÇо÷ü·Î µî·ÏµÈ ÈÇй°ÁúÀÌ ¾ø½À´Ï´Ù! |
|
|