 |
 |
|
|
|
| EPON Resin 1009F |
 |
| Epoxy resin |
 |
| BisphenolA-based epoxy resin |
 |
| 25036-25-3 |
 |
EPON Resin 1009F is a very high molecular weight solid epoxy resin derived from a liquid epoxy resin and bisphenol-A.
This resin is used extensively as a vehicle or binder in high performance industrial baking type surface coatings.
In these coatings the EPON Resin 1009F is usually combined with urea-formaldehyde or phenol-formaldehyde resins to achieve the desired film properties. Coatings of this type exhibit outstanding flexibility and adhesion plus exceptional resistance to chemicals and solvents. Some typical applications of EPON Resin 1009F/urea-formaldehyde or phenol-formaldehyde coatings include linings for metal con-tainers, appliance primers, metal furniture finishes and wire coatings.
This resin also finds application in powder coatings. |
 |
Weight per epoxide: 2300-3800
Viscosity, Centipoise, @ 25'C: 100-250
Color: 200
Vapor pressure, mm Hg @ 25'C: Negligible
Solubility in water: Negligible
Viscosity, @ 25'C: Z2 -Z5
Melting point, 'C: 130-140
Esterification equivalent weight: 220
Weight per gallon, @ 20'C, Pounds: 10.3
Flash point, Setaflash,: >200'F
Bulk density, Ibs./ft.: 36-40
Hydroxyl content, equivalents/100 grams: 0.32 0.34
Sodium content, ppm: 0-2 |
| 제품관련분야 |
첨가제, 무기화합물, 페인트,잉크 |
|
|
|
|
