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| DCU-O |
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| Copper |
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| Copper Nanoparticles in Toluene Solvent |
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| 7440-50-8 |
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PCB electrode seed layer
PCB pattern repairing materials |
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Size Distribution : 30~100
D50(nm,PSA) : 47.34
Metal Contents(wt%) : On Demand
Solvent : Toluene etc(Non-Polar Solvents)
Resistivity(µ
Ω·㎝) : <12.0
Curing Method : Photonic Sintering
Substrate : Plastic Films |
| 제품관련분야 |
기타, 무기화합물, 용제, 첨가제, 항균제, 화장품 |
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