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| NMP |
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| N-Methyl pyrrolidone-based |
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NMP is a unique solvent designed for deflashing and decapsulation of cured epoxy systems.
It is not a true solvent for the epoxies but causes disintegration by flaking or breaking the cured epoxy system.
NMP must be used hot to be most effective on epoxies.
It will not discolor nor attack metal or plating commonly used in electronic assemblies.
*Applications: NMP will disintegrate most epoxy systems when used hot 220-350'F.
It is not a selective system and will attack most thermoplastics, wire coating insulation and many thermoset coatings.
NMP is an excellent solvent for removal of carbonized fluxes. NMP is a most effective chemical deflashing agent for use in IC’s and discrete solid state devices.
It is also effective in the removal of cured polyurethanes. |
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Physical Form: Clear to Light Amber Liquid
Boiling point: 395'F
Flash point: 205'F (open cup) |
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