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Nylon: Low moisture absorption, Industry standard for platable grades, Cost-effective milled glass replacement , Improved mold flow , Uniform heat distribution , Better dimensional stability , Improved surface characteristics , Higher heat-distortion temperature , Upgraded mechanical properties , Reduced wall thickness
Phenolic Molding Compounds: , Low resin demand, better wetout , High loadings-good flow , Faster mold cycle time , Highly reinforcing , Cost-effective milled glass replacement , Improved machinery of molded parts , Low moisture absorption , Enhanced compression strength , Excellent dimensional stability , Improved physical and electrical properties at elevated temperatures
Epoxy: , Higher mineral loading , Low moisture absorption , Improved thermal conductivity , Improved resistance to thermal shock , Higher heat-distortion temperature , Better machinability of molded parts , Greater impact resistance , Improved crack resistance , Cost reduction
Polyester: , Viscosity reduction , Low moisture absorption , Improved surface appearance , Promotes better platability , Excellent heat stability , Improved flexural strength , Better electrical insulating properties , Cost-effective partial glass replacement
Polyurethane: , Cost-effective glass replacement in RRIM , Better distinction of image in RRIM than glass fiber , Low Viscosity , Nonsettling, no hardpanning in casting compounds , Low moisture absorption , Isotropic replacement in RRIM , High flexural modulus , Lower coefficient of thermal expansion , Reduced heat sag |
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