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| BYK-W 995 |
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| Solution of a copolymer with acidic groups |
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BYK-W 995 is a wetting and dispersing additive for moulding compounds such as SMC and BMC.
It is recommended to use BYK-W 995 for filler dispersion to reduce viscosity in LP- and LS-systems.
BYK-W 995 cannot be used in cobalt accelerated resins! BYK-W 995 is often used in amine accelerated cont.
laminating processes to lower viscosity, allowing more efficient production and/or higher filler loading. |
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Acid value: 53 mg KOH/g
Non-volatile matter: 52 %
Density at 20 'C: 1.03 g/ml
Refractive index: 1.462
Flash point: 42 'C |
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