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| EPON Resin 2002 |
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| Epoxy resin |
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| epoxy resin |
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EPON Resin 2002 is a solid bisphenol A/epichlorohydrin epoxy resin that is designed specifically for thin-film functional and decorative epoxy powder coating applications.
Some examples of these applications are appliance finishes, decorative bottle coatings, and high performance finishes for automotive parts, metal shelving, and institutional furniture.
EPON Resin 2002 provides extended gelation time in epoxy powder coatings: however, it affords rapid cure speeds when combined with accelerated dicyandiamide curing agents.
The resin’s low melt viscosity at baking temperatures provides outstanding flow character istics and yields high gloss coatings.
For those powder coating applications requiring ultra-high flow characteristics, product can be selected from the lower range of the EPON Resin 2002 sales specifications.
Please contact your Resolution Performance Products Sales Representative for assistance. |
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Epoxide equivalent welght: 675-760
Viscosity, cP, at 25'C: 10-17
Color: 100 max.
Melt viscosity, Poise, at 150'C: 20-40
Density, grams/ml: 1.18
Bulk density, Ibs/ft: 36-40 |
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