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| Erisys EMDA 3-23 |
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| 67989-52-0 |
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ERISYS EMDA 3-23 is an adduct of a DGEBA resin and a dimer fatty acid. At room temperature EMDA 3-23 is a semi-solid which requires mild heating to assist flow or pumping. The introduction of the fatty acid to the DGEBA backbone yields a resin which will impart a degree of flexibility to cured epoxy formulations.
EDMA 3-23 is usually blended with other epoxy resins and/or diluents to improve thermal shock, and impact resistance. Improvements in adhesion and peel strength will also be realized. These improvements occur, however, with some sacrifice in heat resistance as exemplified by a lowering of Tg with increasing EMDA 3-23 concentration. EMDA 3-23 is compatible with all standard epoxy resins and curing agents.
* APPLICATIONS
- Adhesives
- Encapsulating
- Potting
- Coatings
- Toughening of prepreg and composites |
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Appearance : Clear, Clean
Viscosity @ 50'C, poise : 900 - 1,300
Epoxide Equivalent Weight, g/eq : 670 - 770
Acid Number, max : 0.2
Gardner Color, max : 10
Weight per Gallon, @ 25'C, lbs. : 9.0
Flash Point, COC, 'C ('F) : >200 |
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