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| Omicure U-24 |
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| 17526-94-2 |
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OMICURE U-24, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE U-24 to epoxy/dicy formulations reduces the time and/or temperature required to cure these shelf stable one part products.
Compared to the other CVC substituted ureas, toluene bis dimethyl urea provides the greatest degree of acceleration to epoxy/dicy formulations. OMICURE U-24, at concentrations required to provide an equal degree of acceleration, will produce the least effect on cured properties. Suggested use levels of OMICURE U-24 are <5 phr. Curing can be accomplished in about 50 minutes at 100°C and in less than 3 minutes at temperatures >150°C. Cure times are dependent on the composition of the formulated product and your particular end application.
Room temperature shelf lives (time to double viscosity) of >3 months can be obtained when <1 phr OMICURE U-24 is used with DGEBA/DICY. Some of the factors which can effect shelf life are formulation ingredients and compounding parameters. Ingredients in which OMICURE U-24 is insoluble at processing and storage temperatures will enhance overall storage stability. OMICURE U-24 can be incorporated into your formulation concurrent with the dicy addition.
* APPLICATIONS
As a latent accelerator in the dicyandiamide cure of epoxy resins used in:
- Adhesives
- Powder Coatings
- Prepregs
- Encapsulation
- Reinforcements |
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Appearance : Clean powder
Color : Off white
Odor : Ammoniacal
Melting Point, 'C : 180 - 195
Moisture Content, max % : 1.0
Particle size, min. % through a 325 mesh screen : 80
Particle size, U-24M (micronized) min. % through a 325 mesh screen : 95 |
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