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| Dow Corning 1-4173 |
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1-part gray heat cure, highly thermally conductive, low flow, self-priming.
Bonding integrated circuit substrates: adhering lids and housings: base plate attach: heat sink attach. |
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Product Form: One-Part
Color: Gray
Viscosity/Flowability, centipoise or mPa*s: 58,000
Durometer: 92 A
Specific Gravity: 2.7 |
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