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| Dow Corning 1-4174 Thermally Conductive Adhesive |
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1-part gray heat cure, highly thermally conductive, low flow, same as 1-4173 with 7 mil spacer beads, self-priming.
Bonding integrated circuit substrates: adhering lids and housings: base plate attach: heat sink attach. |
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Thermal Conductivity (watts/meter- degK): 1.90
One or two part: 1
Heat Cure Time: 90 min @ 100'C
Viscosity/Flowability (cps or mPa-sec): 58,000
Durometer: 92 A
Unprimed Adhesion Lap Shear (psi): 590
Color: Gray
Specific Gravity: 2.71 |
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