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| Dow Corning 6811 |
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1-part black heat cure, flowable, self-priming adhesion, DRAM grade.
Good flowability encapsulant for chip scale or other microelectronic packages that require DRAM-grade purity and vacuum dispensability. |
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One or two part: 1
Color: Black
Viscosity/Flowability (poise): 350
Durometer: 60 A
Specific Gravity: 1.25
Working Time RT: >48 hrs
Heat Cure Time: 30 min/150'C
Young's Modulus (M Pa): 2.7
Unprimed Adhesion Lap Shear (psi): 800 |
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