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| Hipec Q1-9239 |
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1-part, black heat cure, controlled thixotropy-flowable as dispensed, self priming adhesion.
For applications where a semiconductor die has been wire bonded to a flat surface.
Particularly suited to applications where there is a need for a flexible coating.
For example with wide extremes of temperature, with the use of a pliable epoxy substrate or where severe thermal shocks are encountered.
Compatible with most semiconductor devices and provides environmental and physical protection of both the chip and interconnecting wires in a single application. |
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One or two part: 1
Color: Black
Viscosity/Flowability (poise): 450
Durometer: 28 A
Specific Gravity: 1.15
Heat Cure Time: 1 hr/150'C |
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