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| Minico M 6300-4 |
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Minico M 6300-4 is a one component, copper filled, solderable, conductive polymer that provides a totally additive copper circuit board process with capabilities for SMD and multilayer interconnections.
It is directly solderable and has no additional processing.
Excess paste on the screen can be returned to the container for later use.
Minico M 6300-4 is cost effective as compared to plating operations.
Further savings from expensive production costs are realized due to air curing.
Minico M 6300-4 does not require a nitrogen atmosphere in a furnace.
Hot air or hand soldering can be used for repairs or component replacement.
Superior adhesion will be achieved when using Minico M 6300-4. |
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Pigment : silver/copper
Binder : thermoset
Diluent : carbitol acetate
Solids content : 91.1%
Flash point : 160'F (70'C)
Number of components : one
Viscosity : 40,000-50,000 mPa.s
(Brookfield Model HBT #14)
Density : 35.9 lbs/gal (4.2-4.4 g/cm3)
VOC : 388 gm/l
Theoretical coverage : 1057 sq ft/gal @ 1 mil (50.41 m2/gal @ 25 탆) |
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