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Dynasolve SP9205
Dynasolve SP9205 is an aqueous-based blend of surface-active materials that are formulated to provide excellent cleaning without the use of solvents or alkalinity sources.
This product is designed for screen printing applications for the removal of uncured solder pastes and surface mount adhesives from stencils and misprinted circuit board assemblies.
It is a non-flammable product that contains no VOC¡¯s and is pH neutral.
Dynasolve SP9205 is a low-foam version of Dynasolve SP9200 and can be used in high-pressure spray applications.
*Application: stencils, fingers, misprints, screen printer, assemblies, through-hole & surface mount electronics.
Appearance: clear to light amber liquid
pH, 1% in DI water: 7-8
Specific gravity: 1.034
Viscosity: 80 cps (concentrate)
Foam: low foam
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Dynaloy, Inc
ÀüÈ­¹øÈ£ 800.669.5709
Æѽº¹øÈ£ 800.671.9583
ȨÆäÀÌÁö www.dynaloy.com
À̸ÞÀÏ info@dynaloy.com
ÁÖ¼Ò P.O. Box 33609 1910 S. State Avenue Indianapolis, IN 46203
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