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| Shin Etsu G-747 |
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For best results, the substrate surface should be cleaned and dried before application.
Greases and fluid compounds should be stirred thoroughly with a spatula before use.
*Applications:
- Good performance is obtained when these materials are used for thermal conductivity of semiconductor devices such as power transistors, ICs, and CPUs.
- For thermal conductivity of resin-encapsulated power transistors.
- These materials are best suited for potting of transistors, rectifiers, thyristors, etc. and heat sink.
- For sealing the measuring parts of thermistors, thermocouples, etc.
- For potting of heat-generating components in devices such as heaters, and heat dissipaters.
*Features:
- Excellent thermal conductivity
- Grease-like products can be screen printed.
- These products show the following characteristics due to their excellent heat and cold-resistance:
.High dropping point
.Less oil separation and lower volatile matter
.Good stability against thermal oxidation
.Good stability against consistency changes
.No solidification at temperatures as low as -50'C |
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Color and Consistency: White, Grease
Penetration (worked): 346
Specific Gravity at 23'C: 2.81
Thermal Conductivity, W/m·K: 1.09
Volume Resistivity: 2.5
Breakdown Voltage kV(0.25mm): 3.7
Temperature Range, 'C: -50 ~ +170 |
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