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| Chungsol C-90 |
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PERFECT ELIMINATION OF EPOXY COMPOUND
RESIDUE(FILM) ON THE LEAD FRAME OF IC FOR THE
GOOD PERFORMANCE OF ASSEMBLY.
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VISUAL APPEARANCE : Clear Pale Yellow liquid
SOLIDITY(%) : 0.00
SPECIFIC GRAVITY(SP.GR) : 1.05 ±0.02
HALIDE CONTENT(%) : 0.00
BOILING RANGE(℃) : 160∼170
K+ CONTENT(%) : 0.00
Na+ CONTENT(%) : 0.00
PHENOL CONTENT(%) : 0.00
IGNITION POINT(℃) : 450
VISCOSITY(cps) : 4.0 |
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