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Sputtering target
Sputtering target

Sputtering target (metal, alloy, oxide and mosaic target):

La, La2O3, Ce, CeO2, Pr, Nd, Nd2O3, Sm, Sm2O3, Eu, Eu2O3, Gd, Gd2O3, Tb, Tb4O7, Dy, Dy2O3, Ho, Ho2O3, Er, Er2O3, Tm, Tm2O3, Yb, Yb2O3, Lu, Lu2O3, Sc, Sc2O3, Y, Y2O3.

Cr, Co, Al, Ni, Ti, W, Mo, Ta, Nb, Zr, Hf, Ru, Pd, Pt, Re, Au, Ag, Cu, Fe

Ho-Cu, Ce-Cu, Sm-Fe, Gd-Fe, Tb-Fe, Dy-Fe, Dy-Co, Gd-Fe-Co, Dy-Fe-Co, Tb-Fe-Co,Nb-Zr, Co-Ni, Zr-Al.

Ta2O5, ZrO2, HfO2, TiB2, B4C, CaF2


Sputtering target (metal, alloy, oxide and mosaic target):

La, La2O3, Ce, CeO2, Pr, Nd, Nd2O3, Sm, Sm2O3, Eu, Eu2O3, Gd, Gd2O3, Tb, Tb4O7, Dy, Dy2O3, Ho, Ho2O3, Er, Er2O3, Tm, Tm2O3, Yb, Yb2O3, Lu, Lu2O3, Sc, Sc2O3, Y, Y2O3.

Cr, Co, Al, Ni, Ti, W, Mo, Ta, Nb, Zr, Hf, Ru, Pd, Pt, Re, Au, Ag, Cu, Fe

Ho-Cu, Ce-Cu, Sm-Fe, Gd-Fe, Tb-Fe, Dy-Fe, Dy-Co, Gd-Fe-Co, Dy-Fe-Co, Tb-Fe-Co,Nb-Zr, Co-Ni, Zr-Al.

Ta2O5, ZrO2, HfO2, TiB2, B4C, CaF2


Foil
Thickness: 0.05mm min.
Length: 1000mm max.
Width: 800mm max.

Wafer
Thickness: 0.05mm min.
Diameter: 600mm max.
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Cathay Advanced Materials Limited
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