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| Polyimide Resin |
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| Polyimide Resin |
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| Polyimide Resin |
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| Polyimide (PI) resin of BMI type. It is a kind of coploymerisation PI prepolymer. It is widely used in Diamond grinding wheels and moulding process powder with short fibre. It also be used for adhesive of laminating composite etc. Its mould pressing products or laminating products can be applied at 260°C in long term and be able to endure a high temperature of 350°C at short term. It is a based resin with excellent comprehensive performance for high temperature-resisting polymeric composite |
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Abbreviation : PI RESIN
Appearance: yellow powder
Density : 1.3g/cm3
Melting point : 142-155℃
Water Absorption : 0.2%
Tensile strength : 113.4MPα
Partical Size : 30-40μm
Solidify Temperature : 230℃
Softening Point : 110---120℃
Martin Heat Resistance Temperature : 260℃
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